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Precision manufacturing & advanced processes
Buying guides & project requirements.

Application-specific Precision manufacturing & advanced processes. Compare equipment boundaries, configuration inputs, project cost and acceptance evidence before requesting an engineering proposal.

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Showing 25–48 of 194 equipment guides.

Ipsen TITAN vacuum furnace — related equipment reference; not the complete silicon carbide pvt crystal growth furnace
Industrial equipment

Silicon carbide PVT crystal growth furnace

Silicon carbide PVT crystal growth furnace. Compare configuration, integration, cost scope, acceptance evidence and OEM/ODM requirements.

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Reference: Ipsen TITAN vacuum furnace — related vacuum heat treatment furnace module/process reference; complete system not pictured

Inductotherm Heavy steel shell furnace — related equipment reference; not the complete czochralski silicon crystal puller
Industrial equipment

Czochralski silicon crystal puller

Czochralski silicon crystal puller. Compare configuration, integration, cost scope, acceptance evidence and OEM/ODM requirements.

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Reference: Inductotherm Heavy steel shell furnace — related induction melting furnace module/process reference; complete system not pictured

Inductotherm Heavy steel shell furnace — related equipment reference; not the complete float zone silicon crystal growth system
Industrial equipment

Float zone silicon crystal growth system

Float zone silicon crystal growth system. Compare configuration, integration, cost scope, acceptance evidence and OEM/ODM requirements.

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Reference: Inductotherm Heavy steel shell furnace — related induction melting furnace module/process reference; complete system not pictured

Ipsen TITAN vacuum furnace — related equipment reference; not the complete sapphire crystal growth furnace
Industrial equipment

Sapphire crystal growth furnace

Sapphire crystal growth furnace. Compare configuration, integration, cost scope, acceptance evidence and OEM/ODM requirements.

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Reference: Ipsen TITAN vacuum furnace — related vacuum heat treatment furnace module/process reference; complete system not pictured

Ipsen TITAN vacuum furnace — related equipment reference; not the complete gallium nitride mocvd epitaxy reactor
Industrial equipment

Gallium nitride MOCVD epitaxy reactor

Gallium nitride MOCVD epitaxy reactor. Compare configuration, integration, cost scope, acceptance evidence and OEM/ODM requirements.

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Reference: Ipsen TITAN vacuum furnace — related vacuum heat treatment furnace module/process reference; complete system not pictured

Busch R5 RA 0155 A — related equipment reference; not the complete molecular beam epitaxy system
Industrial equipment

Molecular beam epitaxy system

Molecular beam epitaxy system. Compare configuration, integration, cost scope, acceptance evidence and OEM/ODM requirements.

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Reference: Busch R5 RA 0155 A — related industrial vacuum pump module/process reference; complete system not pictured

Ipsen TITAN vacuum furnace — related equipment reference; not the complete chemical vapor deposition diamond reactor
Industrial equipment

Chemical vapor deposition diamond reactor

Chemical vapor deposition diamond reactor. Compare configuration, integration, cost scope, acceptance evidence and OEM/ODM requirements.

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Reference: Ipsen TITAN vacuum furnace — related vacuum heat treatment furnace module/process reference; complete system not pictured

Ipsen TITAN vacuum furnace — related equipment reference; not the complete hydride vapor phase epitaxy reactor
Industrial equipment

Hydride vapor phase epitaxy reactor

Hydride vapor phase epitaxy reactor. Compare configuration, integration, cost scope, acceptance evidence and OEM/ODM requirements.

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Reference: Ipsen TITAN vacuum furnace — related vacuum heat treatment furnace module/process reference; complete system not pictured

Lapmaster Wolters Model 36 open-face flat lapping machine — related equipment reference; not the complete wafer chemical mechanical polishing system
Industrial equipment

Wafer chemical mechanical polishing system

Wafer chemical mechanical polishing system. Compare configuration, integration, cost scope, acceptance evidence and OEM/ODM requirements.

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Reference: Lapmaster Wolters Model 36 open-face flat lapping machine — related industrial lapping machine module/process reference; complete system not pictured

Kent USA KGS-2460AHD — related equipment reference; not the complete wafer back grinding and thinning system
Industrial equipment

Wafer back grinding and thinning system

Wafer back grinding and thinning system. Compare configuration, integration, cost scope, acceptance evidence and OEM/ODM requirements.

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Reference: Kent USA KGS-2460AHD — related surface grinding machine module/process reference; complete system not pictured

Telesis ProStation marking workstation/enclosure (laser configuration varies) — related equipment reference; not the complete stealth laser wafer dicing system
Industrial equipment

Stealth laser wafer dicing system

Stealth laser wafer dicing system. Compare configuration, integration, cost scope, acceptance evidence and OEM/ODM requirements.

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Reference: Telesis ProStation marking workstation/enclosure (laser configuration varies) — related industrial laser marking machine module/process reference; complete system not pictured

Kistler NC joining system — related equipment reference; not the complete precision wafer bonding system
Industrial equipment

Precision wafer bonding system

Precision wafer bonding system. Compare configuration, integration, cost scope, acceptance evidence and OEM/ODM requirements.

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Reference: Kistler NC joining system — related servo electric assembly press module/process reference; complete system not pictured

Telesis ProStation marking workstation/enclosure (laser configuration varies) — related equipment reference; not the complete wafer laser annealing system
Industrial equipment

Wafer laser annealing system

Wafer laser annealing system. Compare configuration, integration, cost scope, acceptance evidence and OEM/ODM requirements.

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Reference: Telesis ProStation marking workstation/enclosure (laser configuration varies) — related industrial laser marking machine module/process reference; complete system not pictured

Busch R5 RA 0155 A — related equipment reference; not the complete semiconductor ion implantation system
Industrial equipment

Semiconductor ion implantation system

Semiconductor ion implantation system. Compare configuration, integration, cost scope, acceptance evidence and OEM/ODM requirements.

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Reference: Busch R5 RA 0155 A — related industrial vacuum pump module/process reference; complete system not pictured

Busch R5 RA 0155 A — related equipment reference; not the complete icp reactive ion etching system
Industrial equipment

ICP reactive ion etching system

ICP reactive ion etching system. Compare configuration, integration, cost scope, acceptance evidence and OEM/ODM requirements.

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Reference: Busch R5 RA 0155 A — related industrial vacuum pump module/process reference; complete system not pictured

Busch R5 RA 0155 A — related equipment reference; not the complete deep reactive ion etching system
Industrial equipment

Deep reactive ion etching system

Deep reactive ion etching system. Compare configuration, integration, cost scope, acceptance evidence and OEM/ODM requirements.

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Reference: Busch R5 RA 0155 A — related industrial vacuum pump module/process reference; complete system not pictured

Ecoclean EcoCcube — related equipment reference; not the complete semiconductor wet process bench
Industrial equipment

Semiconductor wet process bench

Semiconductor wet process bench. Compare configuration, integration, cost scope, acceptance evidence and OEM/ODM requirements.

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Reference: Ecoclean EcoCcube — related aqueous spray parts washer module/process reference; complete system not pictured

Busch R5 RA 0155 A — related equipment reference; not the complete vapor phase mems release etching system
Industrial equipment

Vapor phase MEMS release etching system

Vapor phase MEMS release etching system. Compare configuration, integration, cost scope, acceptance evidence and OEM/ODM requirements.

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Reference: Busch R5 RA 0155 A — related industrial vacuum pump module/process reference; complete system not pictured

Ipsen TITAN vacuum furnace — related equipment reference; not the complete rapid thermal processing system
Industrial equipment

Rapid thermal processing system

Rapid thermal processing system. Compare configuration, integration, cost scope, acceptance evidence and OEM/ODM requirements.

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Reference: Ipsen TITAN vacuum furnace — related vacuum heat treatment furnace module/process reference; complete system not pictured

Ipsen ATLAS atmosphere furnace — related equipment reference; not the complete semiconductor diffusion oxidation furnace
Industrial equipment

Semiconductor diffusion oxidation furnace

Semiconductor diffusion oxidation furnace. Compare configuration, integration, cost scope, acceptance evidence and OEM/ODM requirements.

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Reference: Ipsen ATLAS atmosphere furnace — related controlled atmosphere hardening furnace module/process reference; complete system not pictured

Busch R5 RA 0155 A — related equipment reference; not the complete electron beam lithography system
Industrial equipment

Electron beam lithography system

Electron beam lithography system. Compare configuration, integration, cost scope, acceptance evidence and OEM/ODM requirements.

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Reference: Busch R5 RA 0155 A — related industrial vacuum pump module/process reference; complete system not pictured

Banner Engineering VE smart camera — related equipment reference; not the complete uv mask alignment lithography system
Industrial equipment

UV mask alignment lithography system

UV mask alignment lithography system. Compare configuration, integration, cost scope, acceptance evidence and OEM/ODM requirements.

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Reference: Banner Engineering VE smart camera — related machine vision camera module/process reference; complete system not pictured

Kistler NC joining system — related equipment reference; not the complete nanoimprint lithography system
Industrial equipment

Nanoimprint lithography system

Nanoimprint lithography system. Compare configuration, integration, cost scope, acceptance evidence and OEM/ODM requirements.

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Reference: Kistler NC joining system — related servo electric assembly press module/process reference; complete system not pictured

Telesis ProStation marking workstation/enclosure (laser configuration varies) — related equipment reference; not the complete pcb laser direct imaging system
Industrial equipment

PCB laser direct imaging system

PCB laser direct imaging system. Compare configuration, integration, cost scope, acceptance evidence and OEM/ODM requirements.

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Reference: Telesis ProStation marking workstation/enclosure (laser configuration varies) — related industrial laser marking machine module/process reference; complete system not pictured

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